ligitek electronics co.,ltd. property of ligitek only L9UG3330-PF super bright round type led lamps data sheet doc. no : qw0905- rev. : date : - 2006 02 - aug. L9UG3330-PF a pb lead-free parts
package dimensions + - ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 60 75%100% 0 -30 directivity radiation 25% 25%0 75% 100%50% -60 50% 30 25.0min 1.0min 2.54typ L9UG3330-PF part no. 1.5max 8.6 0.5 typ 7.6 5.0 5.9 page 1/5
static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * color lens material part no emitted 220 luminous intensity @20ma(mcd) typ. 20 spectral halfwidth nm 574 dominant wave length dnm max. forward voltage @ ma(v) min. 120 min. viewing angle 2 1/2 (deg) 36 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a v mw 30 60 9ug ratings 10 2000 ir -40 ~ +85 -40 ~ +100 75 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature electrostatic discharge( * ) reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol esd t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. algainp L9UG3330-PF green diffused green 2.6 1.7 20 L9UG3330-PF part no. 2/5
page 9ug chip 1000 100 1.0 10 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve fig.2 relative intensity vs. forward current ligitek electronics co.,ltd. property of ligitek only 0.5 1.0 1.5 2.0 2.5 3.0 1000 100 10 1.0 forward current(ma) 4080100 60 -20 -4020 0 ambient temperature( ) 5.0 4.0 3.0 100 20 0406080 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.1 1.0 1.1 1.2 1.0 0.8 0.9 -40-20 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z @ 2 5 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) forward voltage(v) 2.0 650 600 550 1.0 0.5 500 0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) fig.4 relative intensity vs. temperature 0 0 0.5 1.0 1.5 2.0 2.5 3.0 f o r w a r d c u r r e n t ( m a ) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a part no. L9UG3330-PF 3/5
page 4/5 ligitek electronics co.,ltd. property of ligitek only dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 150 time(sec) 260 c3sec max temp( c) 260 100 120 50 preheat 0 0 25 2 /sec max 5 /sec max 60 seconds max L9UG3330-PF part no.
page 5/5 ligitek electronics co.,ltd. property of ligitek only reference standard description mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. test item reliability test: high temperature storage test low temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. thermal shock test high temperature high humidity test operating life test solderability test 1.t.sol=230 5 2.dwell time=5 1sec test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles part no. L9UG3330-PF
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